Suppressing tin whisker growth in lead-free solders and platings
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United States of America Patent
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Apr 29, 2014
Grant Date -
Apr 11, 2013
app pub date -
Oct 10, 2011
filing date -
Oct 10, 2011
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Abstract
A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
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