Method for forming a back-side illuminated image sensor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 22, 2014
Grant Date -
Oct 18, 2012
app pub date -
Apr 12, 2012
filing date -
Apr 12, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for forming a back-side illuminated image sensor from a semiconductor substrate, including the steps of: a) thinning the substrate from its rear surface; b) depositing, on the rear surface of the thinned substrate, an amorphous silicon layer of same conductivity type as the substrate but of higher doping level; and c) annealing at a temperature enabling to recrystallized the amorphous silicon to stabilize it.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully