Method of forming a through hole by laser drilling
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United States of America Patent
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Apr 22, 2014
Issued Date -
N/A
app pub date -
Mar 2, 2009
filing date -
Feb 28, 2008
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Abstract
A method for forming a through hole, which resolves many problems of conventional method for forming a through hole by applying laser beam and can easily control a shape of the through hole so as to form even diameters at a laser incident side and an opposite side without dependence on a shape of a work object, and form a counter-tapered hole with a diameter at the opposite side larger than that at the incident side, is provided. In the method based on a laser ablation method for forming a through hole, the laser beam is applied on a laser beam exit surface of the work object to be in contact with at least one of a colloid solution of a high-polymer material, a solution of a high-polymer material or polyol.
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