Wireless chip and manufacturing method of the same

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United States of America Patent

PATENT NO 8698262
SERIAL NO

11213997

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Abstract

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The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABORATORY CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dairiki, Koji Isehara, JP 117 2505
Kusumoto, Naoto Isehara, JP 259 6841
Tsurume, Takuya Atsugi, JP 85 2212

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