Manufacturing method of optical electronic components and optical electronic components manufactured using the same
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United States of America Patent
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Apr 15, 2014
Grant Date -
Jun 14, 2007
app pub date -
Feb 6, 2007
filing date -
Apr 26, 2004
priority date (Note) -
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Abstract
There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.
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