Material for packaging electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 8, 2014
Issued Date -
N/A
app pub date -
Apr 1, 2010
filing date -
Apr 3, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully