Method of forming a solder joint
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United States of America Patent
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Apr 8, 2014
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app pub date -
Jun 14, 2013
filing date -
May 25, 2011
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Abstract
A method of forming a solder joint includes the steps of providing a heat shield member formed as an arcuate preferably metallic shell attached to a spring-clamp by means of an obedient shaft; attaching the spring clamp to a structure adjacent the solder joint; moving the heat shield member by bending the obedient shaft so that the heat shield member is positioned in a location spaced-apart from the solder joint with the concave surface of the heat shield member facing the solder joint; and applying heat from a torch to the solder joint from the side opposite the heat shield so that the heat shield reflects the heat back onto the solder joint.
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