Integrated circuit system with contact distribution film
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United States of America Patent
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Apr 1, 2014
Grant Date -
Feb 7, 2008
app pub date -
Aug 2, 2006
filing date -
Aug 2, 2006
priority date (Note) -
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Abstract
A integrated circuit system including providing an integrated circuit device, forming an undoped insulating layer over the integrated circuit device, forming a thin insulating layer over the undoped insulating layer, forming a doped insulating layer over the thin insulating layer, and forming a contact in the undoped insulating layer, thin insulating layer and the doped insulating layer.
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