Compression molding method for electronic component and compression molding apparatus employed therefor
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United States of America Patent
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Apr 1, 2014
Grant Date -
Apr 19, 2012
app pub date -
Dec 22, 2011
filing date -
Nov 2, 2006
priority date (Note) -
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Abstract
First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
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