Semiconductor package with sleeve member and fan wheel for heat dissipation
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United States of America Patent
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Mar 25, 2014
Grant Date -
Feb 28, 2013
app pub date -
Mar 23, 2012
filing date -
Aug 23, 2011
priority date (Note) -
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Abstract
A semiconductor package is provided for carrying a sleeve member and a fan wheel axially coupled to the sleeve member so as to provide a heat dissipating function. The semiconductor package includes: a substrate; a coil module and at least an electronic component disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the coil module and the electronic component so as to prevent the coil module and the electronic component from disturbing air flow generated by the fan wheel during operation, thereby avoiding generation of noises or vibrations.
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