Mitigating the effects of defects in high temperature semiconductor wires
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United States of America Patent
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Mar 25, 2014
Grant Date -
Sep 27, 2012
app pub date -
Mar 8, 2012
filing date -
Mar 21, 2011
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Abstract
A method includes locating a defect in a first segment of high temperature superconducting wire. A second segment of high temperature superconducting wire is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.
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