Manufacturing method for semiconductor device
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United States of America Patent
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Mar 18, 2014
Grant Date -
Jan 31, 2013
app pub date -
Sep 21, 2012
filing date -
Jun 8, 2005
priority date (Note) -
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Abstract
A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.
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