Method for packing solid organometallic compound and packed container
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United States of America Patent
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Mar 18, 2014
Grant Date -
Aug 2, 2007
app pub date -
Jan 27, 2006
filing date -
Jan 27, 2006
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Abstract
A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.
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