Methods and apparatus for cleaning semiconductor wafers
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United States of America Patent
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Mar 18, 2014
Grant Date -
Feb 6, 2014
app pub date -
Oct 11, 2013
filing date -
Dec 10, 2007
priority date (Note) -
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Abstract
An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
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