Mechanical temperature compensation methods and devices

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United States of America Patent

PATENT NO 8664832
SERIAL NO

13106644

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Abstract

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The disclosure pertains to a device and a method for compensating for heat expansion effects in solid materials, as well as a method for manufacturing the device.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO LTDMINDRAY BUILDING KEJI 12TH ROAD SOUTH HI-TECH INDUSTRIAL PARK SHENZHEN 518057

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cewers, Göran Limhamn, SE 19 53

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