Semiconductor substrate, package and device
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United States of America Patent
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Mar 4, 2014
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N/A
app pub date -
Nov 17, 2009
filing date -
Nov 17, 2008
priority date (Note) -
Expired
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Abstract
A semiconductor substrate including a carrier, a first conductive layer and a second conductive layer is disclosed. The carrier has a first surface, a second surface, and a concave portion used for receiving a semiconductor element. The first conductive layer is embedded in the first surface and forms a plurality of electric-isolated package traces. The second conductive layer is embedded in the second surface and electrically connected to the first conductive layer. The semiconductor substrate can be applied to a semiconductor package for carrying a semiconductor chip, and combined with a filling structure for fixing the chip. Furthermore, a plurality of the semiconductor substrates can be stacked and connected via adhesive layers, so as to form a semiconductor device with a complicated structure.
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