Strengthened micro-electromechanical system devices and methods of making thereof
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United States of America Patent
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Mar 4, 2014
Grant Date -
Aug 16, 2012
app pub date -
Feb 14, 2011
filing date -
Feb 14, 2011
priority date (Note) -
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Abstract
In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.
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