Reactive hot melt adhesive with improved hydrolysis resistance

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United States of America Patent

PATENT NO 8664330
APP PUB NO 20040198899A1
SERIAL NO

10408141

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Abstract

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High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBH40589 DÜSSELDORF

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Wayne K Basking Ridge, US 13 108
Cole, Ingrid Flemington, US 15 74
Hung, Ju-Ming Yardley, US 19 158
Zhang, Yue S Somerset, US 10 74

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