Electronic device with heat pipe chamber cover for dissipating heat
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United States of America Patent
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Feb 25, 2014
Grant Date -
Dec 6, 2012
app pub date -
Aug 8, 2011
filing date -
May 31, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.
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