Dual position DC magnetron assembly
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United States of America Patent
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Feb 25, 2014
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N/A
app pub date -
Feb 29, 2012
filing date -
Feb 10, 2009
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Abstract
A sputtering system includes a first sputtering assembly configured to sputter material onto a first disk and a second sputtering assembly configured to sputter material onto a second disk, the second sputtering assembly positioned proximate the first sputtering assembly. The first sputtering assembly includes a first magnetic ring, and the second sputtering assembly includes a second magnetic ring. The first magnetic ring includes a first region of lower relative magnetic strength positioned near the second magnetic ring, and the second magnetic ring includes a second region of lower relative magnetic strength positioned near the first magnetic ring.
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