Solar cell lead, method of manufacturing the same, and solar cell using the same
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United States of America Patent
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Feb 18, 2014
Grant Date -
Sep 2, 2010
app pub date -
Feb 26, 2010
filing date -
Feb 27, 2009
priority date (Note) -
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Abstract
A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
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