Inclusion complex containing epoxy resin composition for semiconductor encapsulation

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United States of America Patent

PATENT NO 8653160
APP PUB NO 20100179250A1
SERIAL NO

12733462

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Abstract

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The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II):

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Patent Owner(s)

Patent OwnerAddress
NIPPON SODA CO LTD2-7-2 MARUNOUCHI CHIYODA-KU TOKYO 1007010 ?1007010

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amanokura, Natsuki Ichihara, JP 8 38
Kaneko, Masami Ichihara, JP 23 217
Ono, Kazuo Ichihara, JP 68 648

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