Flux composition and soldering paste composition
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United States of America Patent
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Feb 18, 2014
Grant Date -
Sep 15, 2011
app pub date -
Sep 25, 2009
filing date -
Oct 2, 2008
priority date (Note) -
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Abstract
Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.
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