Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof
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United States of America Patent
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Feb 11, 2014
Grant Date -
Jun 16, 2011
app pub date -
Jun 2, 2009
filing date -
Jun 2, 2008
priority date (Note) -
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Abstract
A semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat conducting body each. The heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element. A spacer, which with regard to the third connection, is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the joining zone thickness of the third connection being greater than that of the first or the second joining zone to ensure that defined joining zone thicknesses in the bonded connection is maintained during the joining process. The third connection can be used for at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device.
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