Photosensitive resin composition, photosensitive dry film and method for forming pattern

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United States of America Patent

PATENT NO 8647806
APP PUB NO 20120301830A1
SERIAL NO

13519418

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Abstract

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The present invention is related to a photosensitive resin composition containing: a vinyl-based copolymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl monomer (b); a quinonediazide compound (II) and a compound (III) represented by the following formula (5), and to a photosensitive dry film and a method for forming a patter by using the photosensitive resin composition.

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Patent Owner(s)

Patent OwnerAddress
MICRO PROCESS INC2-119-7 AKAYAMA-CHO KOSHIGAYA-SHI SAITAMA 343-0807

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lan, Wei Jen Taoyuan Hsien, TW 2 0
Lin, Chao Wen Taoyuan Hsien, TW 2 0
Nakagawara, Hidetaka Toyohashi, JP 3 1
Ueda, Akifumi Toyohashi, JP 14 34
Watanabe, Kazuo Koshigaya, JP 253 2964
Watanabe, Shigeki Koshigaya, JP 152 1846

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