Method for polishing a semiconductor wafer
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United States of America Patent
Stats
-
Feb 11, 2014
Grant Date -
Jul 25, 2013
app pub date -
Mar 11, 2013
filing date -
Oct 28, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of polishing a semiconductor wafer using a holding system including a lined cutout the size of the semiconductor wafer that is fixed to a carrier. The method includes holding the semiconductor wafer in the cutout through adhesion of a first side of the semiconductor wafer to a bearing surface in the cutout and polishing a second side of the held semiconductor wafer using a polishing pad that is fixed on a polishing plate while introducing a polishing agent between the second side of the semiconductor wafer and the polishing pad, the polishing pad including fixedly bonded abrasive materials. The carrier is guided during polishing such that a portion of the second side of the semiconductor wafer temporarily projects beyond a lateral edge of a surface of the polishing pad.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2013 Application Filing Year
- B24B Class
- 563 Applications Filed
- 515 Patents Issued To-Date
- 91.48 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 11, 2025 |
