Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
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United States of America Patent
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Feb 11, 2014
Grant Date -
Feb 5, 2009
app pub date -
Oct 27, 2005
filing date -
Nov 2, 2004
priority date (Note) -
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Abstract
The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.
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