Method of preparing a composition in blister packages
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United States of America Patent
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Feb 11, 2014
Grant Date -
Dec 11, 2008
app pub date -
Jun 19, 2008
filing date -
Dec 19, 2005
priority date (Note) -
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Abstract
The present invention provides methods for preparing compositions in blister packages using complex aluminum substrate materials, wherein said complex aluminum substrate materials comprise an intermediate aluminum layer, and first and second outer layers, wherein the material of the first outer layer differs from that of the second outer layer, and the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%.
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