Semiconductor device and method for manufacturing thereof
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United States of America Patent
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Jan 28, 2014
Grant Date -
Dec 10, 2009
app pub date -
Oct 22, 2008
filing date -
Oct 22, 2007
priority date (Note) -
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Abstract
A semiconductor device which includes a first semiconductor chip 10, a first electrode 12 formed on the first semiconductor chip 10, a second semiconductor chip 20 to which the first semiconductor chip 10 is mounted, a second electrode 22 with a protrusion 24, which is formed on the second semiconductor chip 20, and a solder bump 14 which bonds the first electrode 12 and the second electrode 22 to cover at least a part of a side surface of the protrusion 24, and a method for manufacturing thereof are provided.
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