Anti-tamper wrapper interconnect method and a device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 28, 2014
Grant Date -
Aug 16, 2012
app pub date -
Feb 10, 2012
filing date -
Feb 16, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.
First Claim
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International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 7.09 % this patent is cited more than
- 11 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 28, 2025 |
