Package for an electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 28, 2014
Grant Date -
N/A
app pub date -
Feb 20, 2012
filing date -
Jan 15, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 28, 2025 |