Integrated post-exposure bake track
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United States of America Patent
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Jan 28, 2014
Grant Date -
Dec 11, 2008
app pub date -
Jun 6, 2007
filing date -
Jun 6, 2007
priority date (Note) -
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Abstract
Systems and methods for processing wafers, a combined post expose bake and chill unit, and an interface are disclosed. An exemplary system includes a lithography tool, local track, transfer device, transfer device handler, interface unit, and controller to schedule processing. An exemplary combined post expose bake and chill unit includes an enclosure having an opening in its side, and a bake unit and a chill unit in the enclosure. An exemplary interface includes a plurality of enclosures arranged around robot(s) that transfer wafers among the enclosures, one of the plurality of enclosures being an integrated bake and chill unit.
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