Die bonding process incorporating infrared vision system
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United States of America Patent
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Jan 21, 2014
Grant Date -
Mar 3, 2011
app pub date -
Sep 2, 2009
filing date -
Sep 2, 2009
priority date (Note) -
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Abstract
A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.
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