Multilayer wiring board
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United States of America Patent
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Jan 21, 2014
Grant Date -
May 12, 2011
app pub date -
May 22, 2009
filing date -
Jun 6, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A multilayer wiring board 100 comprises a first wiring region 101 where wirings 103a and insulating layers 104a and 104b are alternately laminated, and a second wiring region 102 where a thickness H2 of an insulating layer 104 is twice or more a thickness H1 of the insulating layer in the first wiring region 101 and a width W2 of a wiring 103b is twice or more a width W1 of the wiring in the first wiring region 101. The first wiring region 101 and the second wiring region 102 are integrally formed on the same board.
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