Method for three-dimensional packaging of electronic devices
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United States of America Patent
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Jan 14, 2014
Grant Date -
Aug 8, 2013
app pub date -
Jun 7, 2012
filing date -
Feb 8, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An interposer is fabricated from a lamina. A donor body is provided, ions are implanted into a first surface of the donor body to define a cleave plane, a temporary carrier is separably contacted to the donor body, and the lamina is cleaved from the donor body. The lamina has front surface and a back surface, with a thickness from the front surface to the back surface. A via hole is formed in the lamina, where the via hole extends through the thickness of the lamina. The temporary carrier is removed from the lamina, and the lamina may be fabricated into an interposer for three-dimensional integrated circuit packages.
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