Conductive pattern formation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 14, 2014
Issued Date -
N/A
app pub date -
Jun 19, 2008
filing date -
Jun 21, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2008 Application Filing Year
- H05K Class
- 3295 Applications Filed
- 1697 Patents Issued To-Date
- 51.51 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 14, 2025 |