Low pressure molding encapsulation of high voltage circuitry
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United States of America Patent
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Jan 14, 2014
Grant Date -
Dec 16, 2010
app pub date -
Feb 6, 2008
filing date -
Feb 6, 2007
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Abstract
A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.
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