Through hole forming method, nozzle plate and MEMS device
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United States of America Patent
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Jan 7, 2014
Grant Date -
Sep 6, 2012
app pub date -
Mar 1, 2012
filing date -
Mar 2, 2011
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Abstract
A through hole forming method includes forming a plurality of small holes in a first substrate surface of a substrate including the first substrate surface and a second substrate surface as a back surface of the first substrate surface, forming a thermally oxidized film by thermally oxidizing partition walls between the adjacent small holes and bottoms of the small holes, and removing the thermally oxidized film.
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