Adhesive/spacer island structure for multiple die package
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United States of America Patent
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Jan 7, 2014
Grant Date -
Jan 18, 2007
app pub date -
Sep 11, 2006
filing date -
May 24, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
An adhesive/spacer structure (52, 52A, 60) is used to adhere first and second die (14, 18) to one another at a chosen separation in a multiple-die semiconductor chip package (56). The first and second die define a die bonding region (38) therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands (52, 52A) securing the first and second die to one another at a chosen separation (53). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region.
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