LED chip package structure using sedimentation and method for making the same
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United States of America Patent
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Jan 7, 2014
Grant Date -
Jan 5, 2012
app pub date -
Sep 14, 2011
filing date -
Jul 11, 2008
priority date (Note) -
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Abstract
An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
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