Heat pipe and circuit board with a heat pipe function
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United States of America Patent
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Dec 17, 2013
Grant Date -
May 3, 2012
app pub date -
Mar 9, 2009
filing date -
Mar 26, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.
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