Microelectromechanical resonators having resistive heating elements therein configured to provide frequency tuning through convective heating of resonator bodies
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United States of America Patent
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Dec 17, 2013
Grant Date -
N/A
app pub date -
Sep 30, 2011
filing date -
Sep 30, 2011
priority date (Note) -
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Abstract
A microelectromechanical resonator includes a resonator body, which is encapsulated within a sealed cavity extending between first and second substrates that are bonded together. The resonator body is anchored to the first substrate by at least a pair of tethers that suspend the resonator body opposite an underlying recess in the first substrate. A resistive heating element is provided, which is configured to indirectly heat the resonator body through convective heating of the cavity. This resistive heating element may be disposed on an inner surface of the second substrate that is exposed to the cavity. The resonator may also include first and second electrical interconnects, which extend through the second substrate and contact respective first and second portions of the resistive heating element.
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 17, 2025 |