Method for laser singulation of chip scale packages on glass substrates
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United States of America Patent
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Dec 17, 2013
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N/A
app pub date -
Mar 27, 2009
filing date -
Mar 27, 2009
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Abstract
An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
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