Magnet structure and cathode electrode unit for magnetron sputtering, and magnetron sputtering system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8608918
APP PUB NO 20100230282A1
SERIAL NO

12067908

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Abstract

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A magnet structure and the like are provided, which can reduce the labor required to make a magnet design for producing a tunnel-shaped leakage magnetic field for plasma confinement in a well-balanced manner over an obverse surface of a target, based on a quadridirectional magnetic field produced by magnetic interaction between plural magnets. The magnet structure (110) includes: inner and outer magnets (10 and 13) positioned at a reverse surface side of a target (20) to have different magnetic moment orientations for producing a first magnetic force line reaching an obverse surface (20A) of the target (20); a pair of intermediate magnets (11 and 12) positioned at the reverse surface side of the target (20) and between the inner and outer magnets (10 and 13) to have different magnetic moment orientations, for producing a second magnetic force line acting to cancel a widthwise magnetic flux density component which is produced by the first magnetic force line; and a magnetic member (24) positioned at the reverse surface side of the target (20) to guide the second magnetic force line emanating from an end surface of one of the pair of intermediate magnets (11 and 12) into an end surface of the other, the magnetic member (24) being configured to produce a magnetic force line reaching an intermediate point in a thickness direction of the target (20) in association with the inner magnet (10) or the outer magnet (13).

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Patent Owner(s)

Patent OwnerAddress
SHINMAYWA INDUSTRIES LTD1-1 SHINMEIWA-CHO TAKARAZUKA-SHI HYOGO 665-8550

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hori, Takanobu Takarazuka, JP 16 138
Iwasaki, Yasukuni Takarazuka, JP 4 13
Kondo, Takahiko Takarazuka, JP 30 203
Yoneyama, Nobuo Takarazuka, JP 5 46

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