Heat sink package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 10, 2013
Grant Date -
Nov 18, 2010
app pub date -
Jul 28, 2010
filing date -
Feb 4, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same. The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully