Method of manufacturing card

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8603863
APP PUB NO 20120156831A1
SERIAL NO

13404579

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TOPPAN FORMS CO LTD1-7-3 HIGASHI-SHIMBASHI MINATO-KU TOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Yuichi Tokyo, JP 160 1840
Sakurai, Takahiro Tokyo, JP 56 110

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