Process for forming packages
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United States of America Patent
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Dec 10, 2013
Grant Date -
Apr 25, 2013
app pub date -
Oct 24, 2011
filing date -
Oct 24, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.
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