Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit
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United States of America Patent
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Dec 10, 2013
Grant Date -
Jul 12, 2007
app pub date -
Jan 5, 2007
filing date -
Jan 6, 2006
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Abstract
A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.
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