Solution deposition assembly
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United States of America Patent
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Dec 10, 2013
Grant Date -
May 14, 2009
app pub date -
Sep 2, 2008
filing date -
Sep 1, 2007
priority date (Note) -
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Abstract
Methods and devices are provided for improved sputtering systems. In one embodiment of the present invention, a deposition system for use with a substrate, the system comprising a solution deposition apparatus; at heating chamber; and at least assembly for holding solution over the substrate to allow for a depth of at least about 0.5 microns to 10 mm.
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