Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
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United States of America Patent
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Dec 3, 2013
Grant Date -
Oct 18, 2012
app pub date -
Mar 28, 2012
filing date -
May 7, 2002
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Abstract
Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.
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